Laser tools can make vias or orifices in virtually any material, from a thin plastic film to a ceramic wafer or CVD diamond coating. A tightly focused laser beam is an ideal tool, replacing hard tool bits in the manufacturing process.
a) Laser microvia drilling
The first photo featured below is evidence of the difference between mechanical and laser drilling. Precise positioning and excellent depth contol make lasers the tools of choice. Copper and dielectric material removal are both possible.
b) Flex circuit material removal
Flexible circuits can be laser drilled or laser skyved to produce through vias, blind vias or to remove dielectric material and expose conductive pads or fingers. Lasers are also used to excise individual circuits from panels.
c) Ceramic hole drilling and shape cutting
Alumina or any other ceramic material can be processed. Laser micromachining is the perfect way to make inside cutouts of any shape or non-linear cuts, as well as to drill precise vias in most tough and/or brittle materials.
d) Conductive film patterning
Gold, copper, ITO, and most other conductors can be patterned on a variety of substrates like glass, plastics, ceramics, etc.
e) Printed Circuit Board Repair
Silkscreen incident? Ink the wrong place? Spill something on the boards? Often times, you’ll find that it’s cheaper to repair the board, rather than scrap them and start over. Lasers can clean conductive pads of many types of materials, far cleaner than mechanical methods.