Services at PhotoMachining
PhotoMachining, Inc. offers analytical services, design consulting, and custom R&D project management along with a wide variety of contract manufacturing capabilities for industrial laser processing. We also offer turn-key laser systems custom tailored to meet specific demands.
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ANALYTICAL CAPABILITIES
  • Nikon optical comparator for measuring two-dimensional contours of processed parts; featuring 20, 50, and 100X lenses, contour & surface illumination, and digital scales.
  • Nikon high resolution optical microscopes with video micrometers for computer assisted inspection of processed surfaces and orifices (using proprietary in-house software).
  • Stereoscopes with zoom
  • Zygo interferometroc microscope for 3D profiling
  • Amray SEM capabilities, including metallization, with magnification greater than 10,000X available.
  • Analytical equipment integrated into facility network for easy image & data capture, for documentation & transfer.
Quality control
Quality control
Qulality control with high resolution optical microscope and comparator.

DESIGN CONSULTING
PhotoMachining's staff of scientists and engineers will assist you in integrating laser-based machining technology into your manufacturing process. We offer design consulting from concept through finished stages.

In addition, we offer courses and seminars throughout the year on the fundamentals of laser processing.

Click here to see the
upcoming seminar schedule.

DESIGN CONSULTING
Our scientists have been involved in a number of very successful government and privately sponsored R&D efforts and are ready to investigate new approaches to laser applications in manufacturing.

Staff members of PhotoMachining take part in many activities and meetings of major professional societies and institutions, including:

  • LIA
    Laser Institute of America
  • SPIE
    International Society for Optical Engineering
  • MRS
    Materials Research Society
  • OSA
    Optical Society of America
  • IPC
    The Institute for Interconnecting and Packaging Electronic Circuits
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