CONTRACT LASER MICROVIA DRILLING AND SOLDER MASK REMOVAL SERVICES
PhotoMachining is the leader in supplying contract laser microvia drilling services and solder mask removal to the microelectronics industry. We are the only contract manufacturer that has CO2, excimer, fundamental, doubled, tripled and quadrupled Nd:YAG lasers. With this diversity of laser sources, we can tackle almost any material or problem.
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The laser systems available for microvia drilling at PhotoMachining include:
  • Excellon LVD-2000 Dual Laser Microvia Driller with 3W Coherent Avia UV laser, 100W DEOS line narrowed CO2 laser, Scanlab galvos, and a 24"x24" stage. This state-of-the-art laser microvia driller can drill both Cu and dielectric and is fully production capable.
  • Lumonics GS-300 with a 300 Hz TEA CO2 laser combined with a fast galvo and 24" x 24" travel table. This laser takes files in either Excellon2 or DXF format and is capable of drilling microvias in pre-etched copper boards or in screen coated resins at speeds of up to 140 vias per second.
  • Several Coherent AVIA-based PhotoMachining laser systems with 1.5W, 3W, 7W, or 10W diode pumped, frequency tripled (355 nm) Nd:YAG laser. The lasers are interfaced to 24" x 24" linear motor tables with high-speed and repeatability less than a few microns. UV laser light is used for high speed processing of most organics, metals, composites, and laminates. We also have a 3W, 266nm system available
  • Several other CO2 laser systems with fixed beam and galvanometer beam delivery
  • Several 248nm excimer lasers with fixed beam delivery systems and high resolution X/Y tables.
  • 20W Q-switched fiber laser with galvos and table.
  • Short pulse 1064 nm, small field marking/micromachining system
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    All of our lasers are wired to the Internet through our main server for easy file transfer. Please contact PhotoMachining Customer Service to get instructions on how to upload files to our system, via e-mail attachments or FTP.

    A cut of laser drilled plated via.
    4 Tiers of CO2 laser drilled micro vias on 2 mil polyimide
    We will be happy to process your printed circuit boards as prototypes, small lots or on a recurring, high volume contract.

    Please call to discuss your requirements or for a quotation. Quotations are based on total number of vias, material, material thickness, via diameter, via density, total number of boards per lot as well as several other factors.

    Near-zero taper vias 120 microns in diameter in 2.5 mm thick alumina ceramics. The top shows entrance holes, and the bottom shows the side profile.
    High volume contracts or long term processing contracts will be negotiated on an individual basis. Set up costs will also be incurred for each lot run. Programming charges may apply for first time jobs.  

    ITO removal by an excimer laser. Line width is 15 microns.
    Besides microvia drilling, we also do flexible circuit laser processing, dielectric material removal, photo resist removal and patterning, and a variety of other laser based processes. In addition, we can supply the following services:
    1. Ultrasonic cleaning of parts
    2. Automated measurement
    3. High resolution optical micrography
    Please PRESS HERE for more information on these additional services.
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